Fans, Blowers, Thermal Management

658-25AB

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HEATSINK CPU 28MM SQ BLK

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Fans, Blowers, Thermal Management

Active

HEATSINK CPU 28MM SQ BLK

Technical Specifications

Parameters and characteristics for this part

Specification	658-25AB

Attachment Method	Thermal Tape, Adhesive
Fin Height	6.35 mm
Fin Height	0.25 in
Length	27.94 mm
Length	1.1 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	BGA
Power Dissipation @ Temperature Rise	40 °C, 2 W
Shape	Pin Fins, Square
Thermal Resistance @ Forced Air Flow	5 °C/W
Type	Top Mount
Width	27.94 mm
Width [x]	1.1 in

Part	Material Finish	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Shape	Material	Length	Length	Type	Fin Height	Fin Height	Attachment Method	Width	Width [x]	Package Cooled
Wakefield Thermal Solutions 658-25AB	Black Anodized	2 W 40 °C	5 °C/W	Pin Fins Square	Aluminum	27.94 mm	1.1 in	Top Mount	6.35 mm	0.25 in	Thermal Tape Adhesive	27.94 mm	1.1 in	BGA
Wakefield Thermal Solutions 658-25AB	Black Anodized	2 W 40 °C	5 °C/W	Pin Fins Square	Aluminum	27.94 mm	1.1 in	Top Mount	6.35 mm	0.25 in	Thermal Tape Adhesive	27.94 mm	1.1 in	BGA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum 2.0W @ 40°C Top Mount

Technical documentation and resources