658-25 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK CPU 28MM SQ BLK
| Part | Material Finish | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Shape | Material | Length | Length | Type | Fin Height | Fin Height | Attachment Method | Width | Width [x] | Package Cooled |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Black Anodized | 2 W 40 °C | 5 °C/W | Pin Fins Square | Aluminum | 27.94 mm | 1.1 in | Top Mount | 6.35 mm | 0.25 in | Thermal Tape Adhesive | 27.94 mm | 1.1 in | BGA |
Wakefield Thermal Solutions | Black Anodized | 2 W 40 °C | 5 °C/W | Pin Fins Square | Aluminum | 27.94 mm | 1.1 in | Top Mount | 6.35 mm | 0.25 in | Thermal Tape Adhesive | 27.94 mm | 1.1 in | BGA |