Connectors, Interconnects

08-6513-11

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CONN IC DIP SOCKET 8POS GOLD

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Connectors, Interconnects

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CONN IC DIP SOCKET 8POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	08-6513-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	4
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Pitch - Post	Pitch - Post	Features	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish - Post	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Housing Material	Contact Material - Post [custom]	Contact Finish - Mating
Aries Electronics 08-6513-11	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	Closed Frame	Solder	10 Áin	0.25 çm	-55 C	105 ░C	0.1 "	2.54 mm	8	2	4	Gold	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold
Aries Electronics 08-6513-10H	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	Closed Frame	Solder	200 µin	5.08 µm	-55 C	105 ░C	0.1 "	2.54 mm	8	2	4	Tin	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

8 (2 x 4) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources