08-6513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Post | Pitch - Post | Features | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Contact Finish - Post | Type [custom] | Type [custom] | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Housing Material | Contact Material - Post [custom] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 0.1 in | 2.54 mm | Closed Frame | Solder | 10 Áin | 0.25 çm | -55 C | 105 ░C | 0.1 " | 2.54 mm | 8 | 2 | 4 | Gold | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | Beryllium Copper | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass | Gold |
 Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 0.1 in | 2.54 mm | Closed Frame | Solder | 200 µin | 5.08 µm | -55 C | 105 ░C | 0.1 " | 2.54 mm | 8 | 2 | 4 | Tin | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | Beryllium Copper | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass | Gold |