Specification	MCP1630DM-DDBS2

Board Type	Fully Populated
Current - Output	30 mA
Frequency - Switching	100 kHz
Main Purpose	DC/DC, Step Up
Outputs and Type	Non-Isolated
Outputs and Type	1
Regulator Topology	Boost
Supplied Contents	Board(s)
Utilized IC / Part	MCP1630
Voltage - Input [Max]	5.5 V
Voltage - Input [Min]	3 V

MCP1630 Series

High-Speed, Microcontroller-Adaptable PWM

Part	Supplied Contents	Utilized IC / Part	Function	Type	Primary Attributes	Primary Attributes [Max]	Primary Attributes [Min]	Contents	Number of Outputs	Operating Temperature [Min]	Operating Temperature [Max]	Supplier Device Package	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Package / Case	Package / Case [custom]	Package / Case	Output Type	Output Configuration	Mounting Type	Topology	Output Phases	Voltage - Input [Max]	Voltage - Input [Min]	Main Purpose	Outputs and Type	Outputs and Type	Current - Output	Board Type	Regulator Topology	Frequency - Switching	Primary Attributes	Secondary Attributes
Microchip Technology MCP1630RD-DDBK3	Board(s)	MCP1630	Battery Charger	Power Management	4 Cells- Li-Ion	7 V	6.5 V	Board(s)
Microchip Technology MCP1630V-E/MS			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-MSOP	5.5 V	3 V	8-MSOP 8-TSSOP	0.118 in	3 mm	Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1
Microchip Technology MCP1630DM-DDBS2	Board(s)	MCP1630																					5.5 V	3 V	DC/DC Step Up	Non-Isolated	1	30 mA	Fully Populated	Boost	100 kHz
Microchip Technology MCP1630T-E/MC			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-DFN (2x3)	5.5 V	3 V	8-VFDFN Exposed Pad			Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1
Microchip Technology MCP1630-E/MC			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-DFN (2x3)	5.5 V	3 V	8-VFDFN Exposed Pad			Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1
Microchip Technology MCP1630VT-E/MS			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-MSOP	5.5 V	3 V	8-MSOP 8-TSSOP	0.118 in	3 mm	Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1
Microchip Technology MCP1630-E/MS			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-MSOP	5.5 V	3 V	8-MSOP 8-TSSOP	0.118 in	3 mm	Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1
Microchip Technology MCP1630RD-LIC2	Board(s)	MCP1630	Battery Charger	Power Management		14 V	6 V																									1.35 A 3 Cells	Batt Pack Fault Monitoring Cell Temperature Preconditioning
Microchip Technology MCP1630DM-NMC1	Board(s)	MCP1630	Battery Charger	Power Management	4 Cells- NiMH	15 V	8 V																									500 mA
Microchip Technology MCP1630T-E/MS			Step-Down Step-Up Step-Up/Step-Down						1	-40 °C	125 ¯C	8-MSOP	5.5 V	3 V	8-MSOP 8-TSSOP	0.118 in	3 mm	Transistor Driver	Isolation Capable Positive	Surface Mount	Boost Buck Buck-Boost Flyback SEPIC	1

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

MCP1630 Series

The MCP1630 is a high-speed Pulse Width Modulator (PWM) used to develop intelligent power systems. When used with a microcontroller, the MCP1630 will control the power system duty cycle to provide output voltage or current regulation. The MCP1630 inputs are designed to be easily attached to the I/O of a microcontroller, which supplies the reference and oscillator to the MCP1630, to generate a flexible and adaptable power system.

MCP1630DM-DDBS2

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MCP1630DM-DDBS2

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Technical Specifications

MCP1630 Series

Pricing

Description

MCP1630 Series

Documents

Portable Power Conversion Design Guide

Datasheet

MCP1630 Coupled Demo Board Guide

MCP1630 Series