Connectors, Interconnects

32-0518-10T

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Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 32 PINS

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Connectors, Interconnects

32-0518-10T

Active

Aries Electronics

IC & COMPONENT SOCKETS SINGLE ROW COLLET SOLDER TAIL 32 PINS

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	32-0518-10T

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	32
Number of Positions or Pins (Grid) [custom]	1 x 32
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	SIP

X518 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Type	Type	Contact Material - Post [custom]	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 36-1518-00	0.125 in	3.18 mm	3 A	UL94 V-0	36	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Surface Mount	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 15-0518-10T					15	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	15	1
Aries Electronics 37-0518-00	0.046 in	1.17 mm	3 A	UL94 V-0	37	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Surface Mount	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	37	1
Aries Electronics 15-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	15	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	15	1
Aries Electronics 12-1518-10	0.125 in	3.18 mm	3 A	UL94 V-0	12	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 18-0518-11	0.125 in	3.18 mm	3 A	UL94 V-0		Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	10 Áin	0.25 çm	Gold	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	18	1	18
Aries Electronics 06-0518-10T						Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 32-0518-10T	0.125 in	3.18 mm	3 A	UL94 V-0	32	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder				1 x 32
Aries Electronics 42-1518-10T					42	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 11-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	11	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder					1	11

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	157	$ 2.39
	N/A	0	$ 3.13
Mouser	N/A	1	$ 4.63
		10	$ 3.71
		25	$ 3.58
		50	$ 3.53
		100	$ 2.38
		2500	$ 2.35

Description

General part information

X518 Series

32 (1 x 32) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources