X518 Series

Catalog

IC & COMPONENT SOCKETS SURFACE MOUNT COLLET DUAL ROW 36 PINS

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Type	Type	Contact Material - Post [custom]	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 36-1518-00	0.125 in	3.18 mm	3 A	UL94 V-0	36	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Surface Mount	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 15-0518-10T					15	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	15	1
Aries Electronics 37-0518-00	0.046 in	1.17 mm	3 A	UL94 V-0	37	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Surface Mount	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	37	1
Aries Electronics 15-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	15	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	15	1
Aries Electronics 12-1518-10	0.125 in	3.18 mm	3 A	UL94 V-0	12	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 18-0518-11	0.125 in	3.18 mm	3 A	UL94 V-0		Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	10 Áin	0.25 çm	Gold	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	18	1	18
Aries Electronics 06-0518-10T						Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 32-0518-10T	0.125 in	3.18 mm	3 A	UL94 V-0	32	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder				1 x 32
Aries Electronics 42-1518-10T					42	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	DIP	5.08 mm	Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder
Aries Electronics 11-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	11	Beryllium Copper	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	200 µin	5.08 µm	Tin	Gold	SIP		Brass	Through Hole	0.1 in	2.54 mm	0.25 µm	10 µin	Solder					1	11