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Discrete Semiconductor Products

RFN6BGE2DTL

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Rohm Semiconductor

DIODE ARRAY GP 200V 3A TO252GE

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Discrete Semiconductor Products

RFN6BGE2DTL

Active
Rohm Semiconductor

DIODE ARRAY GP 200V 3A TO252GE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN6BGE2DTL
Current - Average Rectified (Io) (per Diode)3 A
Current - Reverse Leakage @ Vr10 ÁA
Diode Configuration1 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252GE
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]980 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.95
10$ 1.25
100$ 0.84
500$ 0.67
1000$ 0.61
Digi-Reel® 1$ 1.95
10$ 1.25
100$ 0.84
500$ 0.67
1000$ 0.61
N/A 2500$ 1.94
Tape & Reel (TR) 2500$ 0.50

Description

General part information

RFN6 Series

RFN6BGE2D is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

RFN6BGE2D Data Sheet

Data Sheet

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Diode Types and Applications

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

RFN6BGE2D ESD Data

Characteristics Data

Judgment Criteria of Thermal Evaluation

Thermal Design