Fans, Blowers, Thermal Management

WAVE-425-117

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LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

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Fans, Blowers, Thermal Management

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	WAVE-425-117

Attachment Method	Clip
Fin Height	11.7 mm
Fin Height	0.461 in
Length	42.5 mm
Length	1.673 in
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Shape [custom]	Angled Fins
Shape [custom]	Square
Thermal Resistance @ Forced Air Flow	3.4 °C/W
Type	Board Level
Width [y]	42.5 mm
Width [y]	1.673 in

Part	Width [y]	Width [y]	Package Cooled	Fin Height	Fin Height	Thermal Resistance @ Forced Air Flow	Attachment Method	Type	Material	Material Finish	Length	Length	Shape [custom]	Shape [custom]
Wakefield Thermal Solutions WAVE-425-117	42.5 mm	1.673 in	BGA	11.7 mm	0.461 in	3.4 °C/W	Clip	Board Level	Aluminum Alloy	Black Anodized	42.5 mm	1.673 in	Angled Fins	Square
Wakefield Thermal Solutions WAVE-425-117	42.5 mm	1.673 in	BGA	11.7 mm	0.461 in	3.4 °C/W	Clip	Board Level	Aluminum Alloy	Black Anodized	42.5 mm	1.673 in	Angled Fins	Square

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum Alloy Board Level

Technical documentation and resources