WAVE-425 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
| Part | Width [y] | Width [y] | Package Cooled | Fin Height | Fin Height | Thermal Resistance @ Forced Air Flow | Attachment Method | Type | Material | Material Finish | Length | Length | Shape [custom] | Shape [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | 42.5 mm | 1.673 in | BGA | 11.7 mm | 0.461 in | 3.4 °C/W | Clip | Board Level | Aluminum Alloy | Black Anodized | 42.5 mm | 1.673 in | Angled Fins | Square |
Wakefield Thermal Solutions | 42.5 mm | 1.673 in | BGA | 11.7 mm | 0.461 in | 3.4 °C/W | Clip | Board Level | Aluminum Alloy | Black Anodized | 42.5 mm | 1.673 in | Angled Fins | Square |