Connectors, Interconnects

68-PGM10005-11H

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Aries Electronics

IC & COMPONENT SOCKETS

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Connectors, Interconnects

68-PGM10005-11H

Active

Aries Electronics

IC & COMPONENT SOCKETS

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	68-PGM10005-11H

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	4.19 mm
Termination Post Length	0.165 "
Type	PGA

68-PGM1 Series

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Housing Material	Contact Finish - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type
Aries Electronics 68-PGM10005-11H	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Solder	10 Áin	0.25 çm	-55 C	125 °C	PGA
Aries Electronics 68-PGM11033-10	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA
Aries Electronics 68-PGM11033-11	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Solder	10 Áin	0.25 çm	-55 C	125 °C	PGA
Aries Electronics 68-PGM10006-10	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm			PGA
Aries Electronics 68-PGM11033-10H	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA
Aries Electronics 68-PGM11032-10	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	25	$ 16.20
	N/A	0	$ 22.11
Mouser	N/A	1	$ 19.41
		10	$ 16.83
		25	$ 15.48
		100	$ 14.95
		250	$ 14.48
		500	$ 14.22

Description

General part information

68-PGM1 Series

Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources