68-PGM1 Series

Catalog

IC & COMPONENT SOCKETS

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Housing Material	Contact Finish - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type
Aries Electronics 68-PGM10005-11H	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Solder	10 Áin	0.25 çm	-55 C	125 °C	PGA
Aries Electronics 68-PGM11033-10	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA
Aries Electronics 68-PGM11033-11	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Solder	10 Áin	0.25 çm	-55 C	125 °C	PGA
Aries Electronics 68-PGM10006-10	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm			PGA
Aries Electronics 68-PGM11033-10H	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA
Aries Electronics 68-PGM11032-10	3 A	4.19 mm	0.165 "	UL94 V-0	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Brass	Through Hole	0.25 µm	10 µin	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Solder	200 µin	5.08 µm	-55 C	105 ░C	PGA