217-36CTRE6
ActiveHEAT SINK, SQUARE, PCB, SURFACE MOUNT, 55 °C/W, D2PAK, SOL-20, SOT-223, TO-220, TO-263, 15.2 MM
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217-36CTRE6
ActiveHEAT SINK, SQUARE, PCB, SURFACE MOUNT, 55 °C/W, D2PAK, SOL-20, SOT-223, TO-220, TO-263, 15.2 MM
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Technical Specifications
Parameters and characteristics for this part
| Specification | 217-36CTRE6 |
|---|---|
| Attachment Method | SMD Pad |
| Fin Height [z] | 9.14 mm |
| Fin Height [z] | 0.36 in |
| Length | 0.74 in |
| Length | 18.8 mm |
| Material | Copper |
| Material Finish | Tin |
| Package Cooled | SOT-223, TO-220, D²PAK (TO-263), SOL-20 |
| Power Dissipation @ Temperature Rise | 1 W |
| Shape [custom] | Rectangular |
| Shape [custom] | Fins |
| Thermal Resistance @ Forced Air Flow | 16 °C/W |
| Thermal Resistance @ Natural | 55 °C/W |
| Type | Top Mount |
| Width [y] | 0.6 in |
| Width [y] | 15.24 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.66 | |
| 1 | $ 0.66 | |||
| 10 | $ 0.63 | |||
| 10 | $ 0.63 | |||
| 25 | $ 0.59 | |||
| 25 | $ 0.59 | |||
| 50 | $ 0.58 | |||
| 50 | $ 0.58 | |||
| 100 | $ 0.57 | |||
| 100 | $ 0.57 | |||
| Digi-Reel® | 1 | $ 0.66 | ||
| 1 | $ 0.66 | |||
| 10 | $ 0.63 | |||
| 10 | $ 0.63 | |||
| 25 | $ 0.59 | |||
| 25 | $ 0.59 | |||
| 50 | $ 0.58 | |||
| 50 | $ 0.58 | |||
| 100 | $ 0.57 | |||
| 100 | $ 0.57 | |||
| N/A | 3725 | $ 0.69 | ||
| 3725 | $ 0.69 | |||
| Tape & Reel (TR) | 250 | $ 0.53 | ||
| 250 | $ 0.53 | |||
| 500 | $ 0.50 | |||
| 500 | $ 0.50 | |||
| 1250 | $ 0.45 | |||
| 1250 | $ 0.45 | |||
| 6250 | $ 0.44 | |||
| 6250 | $ 0.44 | |||
| 12500 | $ 0.41 | |||
| 12500 | $ 0.41 | |||
| 25000 | $ 0.40 | |||
| 25000 | $ 0.40 | |||
Description
General part information
217-36 Series
The 217-36CTRE6 is a Heat Sink made of copper with tin-lead plated finish for improved solderability and assembly. This board level power semiconductor surface mount heat sink features automated production techniques for ease of assembly and a variety of soldering methods, this heat sink allow a greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment. Can be used with water soluble or no clean SMT solder creams or other pastes. It is suitable for use with D2PAK, TO-220, SOT-223 and SOL-20 devices.
Documents
Technical documentation and resources
