623K
ActiveHEAT SINK, SQUARE, PCB, FOR METAL CASED SEMICONDUCTORS, 3.47 °C/W, TO-3, 120.6 MM, 11.71 MM, 121 MM
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623K
ActiveHEAT SINK, SQUARE, PCB, FOR METAL CASED SEMICONDUCTORS, 3.47 °C/W, TO-3, 120.6 MM, 11.71 MM, 121 MM
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Technical Specifications
Parameters and characteristics for this part
| Specification | 623K |
|---|---|
| Attachment Method | Press Fit |
| Fin Height | 11.7 mm |
| Fin Height | 0.461 in |
| Length | 3 in |
| Length | 76.2 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | TO-3 |
| Power Dissipation @ Temperature Rise | 15 W |
| Shape [custom] | Rectangular |
| Shape [custom] | Fins |
| Thermal Resistance @ Forced Air Flow | 1.5 °C/W |
| Thermal Resistance @ Natural | 3.5 °C/W |
| Type | Board Level |
| Width [x] | 120.65 mm |
| Width [x] | 4.75 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
623 Series
The 623K is a Heat Sink made of aluminum with black anodized finish. This extruded low-profile heat sink offers stud mounting. It is a general purpose yet efficient heat dissipater for TO-3 and virtually all other styles of metal case power semiconductor package types, the 623 series low-profile flat back heat sink finds a wide variety of applications. The central channel between fins measures 1.3-inch minimum in width. Mounting hole pattern "A" is predrilled for the standard TO-3 package.
Documents
Technical documentation and resources