623 Series

Catalog

HEAT SINK, SQUARE, PCB, FOR METAL CASED SEMICONDUCTORS, 3.47 °C/W, TO-3, 120.6 MM, 11.71 MM, 121 MM

Part	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Shape [custom]	Shape [custom]	Material	Material Finish	Fin Height	Fin Height	Type	Length	Length	Package Cooled	Attachment Method	Thermal Resistance @ Natural	Width [x]	Width [x]
Wakefield Thermal Solutions 623K	15 W	1.5 °C/W	Rectangular	Fins	Aluminum	Black Anodized	11.7 mm	0.461 in	Board Level	3 in	76.2 mm	TO-3	Press Fit	3.5 °C/W	120.65 mm	4.75 in
Wakefield Thermal Solutions 623K	15 W	1.5 °C/W	Rectangular	Fins	Aluminum	Black Anodized	11.7 mm	0.461 in	Board Level	3 in	76.2 mm	TO-3	Press Fit	3.5 °C/W	120.65 mm	4.75 in