Connectors, Interconnects

36-6556-40

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Aries Electronics

IC & COMPONENT SOCKETS 36 SCKT RECEPT TIN SOLDER CUP

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Connectors, Interconnects

36-6556-40

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Aries Electronics

IC & COMPONENT SOCKETS 36 SCKT RECEPT TIN SOLDER CUP

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	36-6556-40

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	36
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination Post Length	0.18 in
Termination Post Length	4.57 mm
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

36-6556 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish - Post	Type [custom]	Type [custom]	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination
Aries Electronics 36-6556-11	3.3 mm	0.13 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Solder
Aries Electronics 36-6556-31	10.74 mm	0.423 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-40	4.57 mm	0.18 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6556-41	4.57 mm	0.18 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6556-21	7.19 mm	0.283 "	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-30	10.74 mm	0.423 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-10	3.3 mm	0.13 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Solder
Aries Electronics 36-6556-20	7.19 mm	0.283 "	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	9	$ 48.52
	N/A	0	$ 52.66
Mouser	N/A	1	$ 42.48
		25	$ 42.14
		50	$ 41.03
		100	$ 38.71
		250	$ 38.03

Description

General part information

36-6556 Series

36 (2 x 18) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources