36-6556 Series

Catalog

CONN IC DIP SOCKET 36POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish - Post	Type [custom]	Type [custom]	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination
Aries Electronics 36-6556-11	3.3 mm	0.13 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Solder
Aries Electronics 36-6556-31	10.74 mm	0.423 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-40	4.57 mm	0.18 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6556-41	4.57 mm	0.18 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6556-21	7.19 mm	0.283 "	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Gold	15.24 mm	0.6 in	DIP	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-30	10.74 mm	0.423 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap
Aries Electronics 36-6556-10	3.3 mm	0.13 in	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Solder
Aries Electronics 36-6556-20	7.19 mm	0.283 "	3 A	UL94 V-0	0.1 in	2.54 mm	36	Beryllium Copper	Brass	0.1 "	2.54 mm	Through Hole	0.76 Ám	30 Áin	Open Frame	Tin	15.24 mm	0.6 in	DIP	Gold	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Wire Wrap