Connectors, Interconnects

40-0518-10

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Aries Electronics

CONN SOCKET SIP 40POS GOLD

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Connectors, Interconnects

40-0518-10

Active

Aries Electronics

CONN SOCKET SIP 40POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	40-0518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	SIP

40-0518 Series

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Housing Material	Pitch - Post	Pitch - Post	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish - Post	Contact Material - Mating	Features
Aries Electronics 40-0518-10E	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	10 Áin	0.25 çm	0.1 "	2.54 mm	Gold	Gold	Beryllium Copper	Open Frame
Aries Electronics 40-0518-00	0.046 in	1.17 mm	UL94 V-0	3 A	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	10 Áin	0.25 çm	0.1 "	2.54 mm	Gold	Gold	Beryllium Copper	Open Frame

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 4.04
		10	$ 3.67
		100	$ 3.23
		500	$ 2.75
		1000	$ 2.34
	N/A	6377	$ 4.42

Description

General part information

40-0518 Series

40 (1 x 40) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources