40-0518 Series

Catalog

CONN SOCKET SIP 40POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Housing Material	Pitch - Post	Pitch - Post	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish - Post	Contact Material - Mating	Features
Aries Electronics 40-0518-10E	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	10 Áin	0.25 çm	0.1 "	2.54 mm	Gold	Gold	Beryllium Copper	Open Frame
Aries Electronics 40-0518-00	0.046 in	1.17 mm	UL94 V-0	3 A	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	200 µin	5.08 µm	0.1 "	2.54 mm	Gold	Tin	Beryllium Copper	Open Frame
Aries Electronics 40-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Brass	0.25 µm	10 µin	SIP	40	10 Áin	0.25 çm	0.1 "	2.54 mm	Gold	Gold	Beryllium Copper	Open Frame