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18-3518-112
Connectors, Interconnects

18-3518-112

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Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

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18-3518-112
Connectors, Interconnects

18-3518-112

Active
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification18-3518-112
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.25 µm
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post10 Áin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)18
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length0.125 in
Termination Post Length3.18 mm
Type7.62 mm
Type0.3 in
TypeDIP
PartTermination Post LengthTermination Post LengthCurrent Rating (Amps)Material Flammability RatingContact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish Thickness - PostContact Finish Thickness - PostTypeTypeTypePitch - MatingPitch - MatingContact Finish - MatingMounting TypeContact Material - Post [custom]Contact Material - MatingTerminationNumber of Positions or Pins (Grid)Pitch - PostPitch - PostFeaturesHousing MaterialContact Finish - Post
18-3518-101H
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin
18-3518-112
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
10 Áin
0.25 çm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Gold
18-3518-102
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin
18-3518-01
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin
18-3518-10
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin
18-3518-101
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin
18-3518-11H
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
10 Áin
0.25 çm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Gold
18-3518-10H
Aries Electronics
0.125 in
3.18 mm
3 A
UL94 V-0
0.25 µm
10 µin
200 µin
5.08 µm
7.62 mm
0.3 in
DIP
0.1 "
2.54 mm
Gold
Through Hole
Brass
Beryllium Copper
Solder
18
0.1 in
2.54 mm
Open Frame
Polyamide (PA46)
Nylon 4/6
Glass Filled
Tin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 79$ 5.50
N/A 0$ 6.16

Description

General part information

18-3518 Series

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources