18-3518 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Mounting Type	Contact Material - Post [custom]	Contact Material - Mating	Termination	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Features	Housing Material	Contact Finish - Post
Aries Electronics 18-3518-101H	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin
Aries Electronics 18-3518-112	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	10 Áin	0.25 çm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold
Aries Electronics 18-3518-102	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin
Aries Electronics 18-3518-01	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin
Aries Electronics 18-3518-10	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin
Aries Electronics 18-3518-101	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin
Aries Electronics 18-3518-11H	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	10 Áin	0.25 çm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold
Aries Electronics 18-3518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	0.25 µm	10 µin	200 µin	5.08 µm	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Through Hole	Brass	Beryllium Copper	Solder	18	0.1 in	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin