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Connectors, Interconnects

06-3518-11

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Aries Electronics

CONN IC DIP SOCKET 6POS GOLD

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Search across all available documentation for this part.

DocumentsDatasheet
Connectors, Interconnects

06-3518-11

Active
Aries Electronics

CONN IC DIP SOCKET 6POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification06-3518-11
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]2
Number of Positions or Pins (Grid) [custom]6
Number of Positions or Pins (Grid) [custom]3
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
Type0.3 "
Type7.62 mm
TypeDIP

06-3518 Series

PartMaterial Flammability RatingTerminationCurrent Rating (Amps)Contact Material - MatingPitch - MatingPitch - MatingContact Material - Post [custom]Contact Finish - PostTypeTypeTypeMounting TypeHousing MaterialFeaturesContact Finish Thickness - PostContact Finish Thickness - PostContact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish - MatingTermination Post LengthTermination Post LengthPitch - PostPitch - PostNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]
Aries Electronics
UL94 V-0
Solder
3 A
Beryllium Copper
0.1 in
2.54 mm
Brass
Tin
0.3 "
7.62 mm
DIP
Surface Mount
Glass Filled
Nylon 4/6
Polyamide (PA46)
Open Frame
200 µin
5.08 µm
10 çin
0.25 çm
Gold
3.18 mm
0.125 in
2.54 mm
0.1 in
2
6
3
Aries Electronics
UL94 V-0
Solder
3 A
Beryllium Copper
0.1 in
2.54 mm
Brass
Gold
0.3 "
7.62 mm
DIP
Through Hole
Glass Filled
Nylon 4/6
Polyamide (PA46)
Open Frame
10 çin
0.25 çm
10 çin
0.25 çm
Gold
3.18 mm
0.125 in
2.54 mm
0.1 in
2
6
3
Aries Electronics
UL94 V-0
Solder
3 A
Beryllium Copper
0.1 in
2.54 mm
Brass
Gold
0.3 "
7.62 mm
DIP
Through Hole
Glass Filled
Nylon 4/6
Polyamide (PA46)
Open Frame
10 çin
0.25 çm
10 çin
0.25 çm
Gold
3.18 mm
0.125 in
2.54 mm
0.1 in
2
6
3

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 462$ 1.11

Description

General part information

06-3518 Series

6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources