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Technical Specifications
Parameters and characteristics for this part
| Specification | 28-C212-10T |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Closed Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
| Type | DIP |
| Type [custom] | 15.24 mm |
| Type [custom] | 0.6 in |
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish - Mating | Contact Material - Mating | Type [custom] | Type [custom] | Type | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Features | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.04 in | 1.02 mm | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | Wire Wrap | 0.1 " | 2.54 mm | Tin | -55 C | 105 ░C | Through Hole | Closed Frame | 28 | Brass | 0.25 µm | 10 µin |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | Solder | 0.1 " | 2.54 mm | Tin | -55 C | 105 ░C | Through Hole | Closed Frame | 28 | Brass | 5.08 µm | 200 µin | |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | Solder | 0.1 " | 2.54 mm | Gold | -55 C | 125 °C | Through Hole | Closed Frame | 28 | Brass | 0.25 µm | 10 µin |
Aries Electronics | 0.04 in | 1.02 mm | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | Wire Wrap | 0.1 " | 2.54 mm | Tin | -55 C | 105 ░C | Through Hole | Closed Frame | 28 | Brass | 0.25 µm | 10 µin |
Aries Electronics | 0.04 in | 1.02 mm | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | Wire Wrap | 0.1 " | 2.54 mm | Gold | -55 C | 125 °C | Through Hole | Closed Frame | 28 | Brass | 0.25 µm | 10 µin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 90 | $ 5.35 | |
| N/A | 0 | $ 5.42 | ||
Description
General part information
28-C212 Series
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources