28-C212 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Material - Mating	Type [custom]	Type [custom]	Type	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Features	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 28-C212-30	0.04 in	1.02 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Gold	Beryllium Copper	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Wire Wrap	0.1 "	2.54 mm	Tin	-55 C	105 ░C	Through Hole	Closed Frame	28	Brass	0.25 µm	10 µin
Aries Electronics 28-C212-10T	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm		Beryllium Copper	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Tin	-55 C	105 ░C	Through Hole	Closed Frame	28	Brass	5.08 µm	200 µin
Aries Electronics 28-C212-11	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Gold	Beryllium Copper	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Solder	0.1 "	2.54 mm	Gold	-55 C	125 °C	Through Hole	Closed Frame	28	Brass	0.25 µm	10 µin
Aries Electronics 28-C212-20	0.04 in	1.02 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Gold	Beryllium Copper	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Wire Wrap	0.1 "	2.54 mm	Tin	-55 C	105 ░C	Through Hole	Closed Frame	28	Brass	0.25 µm	10 µin
Aries Electronics 28-C212-31	0.04 in	1.02 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Gold	Beryllium Copper	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Wire Wrap	0.1 "	2.54 mm	Gold	-55 C	125 °C	Through Hole	Closed Frame	28	Brass	0.25 µm	10 µin