Connectors, Interconnects

08-2501-30

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Aries Electronics

IC & COMPONENT SOCKETS WIRE WRAP BIFURCATED 8 PINS TIN

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Documents08-2501-30 | Datasheet

Connectors, Interconnects

08-2501-30

Active

Aries Electronics

IC & COMPONENT SOCKETS WIRE WRAP BIFURCATED 8 PINS TIN

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Documents08-2501-30 | Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	08-2501-30

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	4
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Wire Wrap
Type	DIP
Type	5.08 mm

501 Series

Part	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish - Post	Contact Material - Mating	Type	Type	Features	Pitch - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Type [custom]	Type [custom]	Contact Finish - Mating
Aries Electronics 08-2501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP	5.08 mm	Closed Frame	0.1 "	2.54 mm	Wire Wrap	8	2	4	200 µin	5.08 µm
Aries Electronics 10-6501-31	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	10	2	5	10 Áin	0.25 çm	1.5 A	UL94 V-0	17.52 mm	0.69 in	15.24 mm	0.6 in	Gold
Aries Electronics 08-6501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	8	2	4	200 µin	5.08 µm					15.24 mm	0.6 in
Aries Electronics 10-2501-31	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	DIP	5.08 mm	Closed Frame	0.1 "	2.54 mm	Wire Wrap	10	2	5	10 Áin	0.25 çm	1.5 A	UL94 V-0	17.52 mm	0.69 in			Gold
Aries Electronics 18-6501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	18			200 µin	5.08 µm	1.5 A	UL94 V-0	17.52 mm	0.69 in	15.24 mm	0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 3.42
Mouser	N/A	1	$ 5.06
		10	$ 4.05
		25	$ 3.92
		50	$ 3.62
		100	$ 2.61
		2500	$ 2.60

Description

General part information

501 Series

IC & COMPONENT SOCKETS WIRE WRAP BIFURCATED 8 PINS TIN

Documents

Technical documentation and resources

08-2501-30 | Datasheet

Datasheet