501 Series

Catalog

IC & COMPONENT SOCKETS WIRE WRAP BIFURCATED 8 PINS TIN

Part	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish - Post	Contact Material - Mating	Type	Type	Features	Pitch - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Type [custom]	Type [custom]	Contact Finish - Mating
Aries Electronics 08-2501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP	5.08 mm	Closed Frame	0.1 "	2.54 mm	Wire Wrap	8	2	4	200 µin	5.08 µm
Aries Electronics 10-6501-31	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	10	2	5	10 Áin	0.25 çm	1.5 A	UL94 V-0	17.52 mm	0.69 in	15.24 mm	0.6 in	Gold
Aries Electronics 08-6501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	8	2	4	200 µin	5.08 µm					15.24 mm	0.6 in
Aries Electronics 10-2501-31	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Gold	Phosphor Bronze	DIP	5.08 mm	Closed Frame	0.1 "	2.54 mm	Wire Wrap	10	2	5	10 Áin	0.25 çm	1.5 A	UL94 V-0	17.52 mm	0.69 in			Gold
Aries Electronics 18-6501-30	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	Phosphor Bronze	Tin	Phosphor Bronze	DIP		Closed Frame	0.1 "	2.54 mm	Wire Wrap	18			200 µin	5.08 µm	1.5 A	UL94 V-0	17.52 mm	0.69 in	15.24 mm	0.6 in