
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | DF13C-6P-1.25V(90) |
|---|---|
| null | |
| Part | Mated Stacking Heights | Fastening Type | Insulation Color | Operating Temperature [Max] | Operating Temperature [Min] | Style | Number of Positions | Features | Mounting Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height | Insulation Height | Contact Material | Contact Shape | Voltage Rating | Termination | Connector Type | Insulation Material | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Type | Material Flammability Rating | Number of Rows | Shrouding | Contact Finish - Post | Contact Finish Thickness - Mating [custom] | Contact Finish Thickness - Mating [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 14 | Solder Retention | Surface Mount | All | 8 µin | 0.203 µm | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | |||
Hirose Electric Co Ltd | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 8 | Solder Retention | Surface Mount | All | 4.8 mm | 0.189 in | Brass | Square | 150 VAC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | Gold | |||||
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 7 | Solder Retention | Surface Mount | All | 8 µin | 0.203 µm | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | |||
Hirose Electric Co Ltd | ||||||||||||||||||||||||||||||
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 9 | Solder Retention | Surface Mount | All | 8 µin | 0.203 µm | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | |||
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 9 | Solder Retention | Surface Mount | All | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | Tin | 39.4 µin | 1 µm | |||
Hirose Electric Co Ltd | ||||||||||||||||||||||||||||||
Hirose Electric Co Ltd | ||||||||||||||||||||||||||||||
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 9 | Solder Retention | Surface Mount | All | 8 µin | 0.203 µm | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall | |||
Hirose Electric Co Ltd | 5.8 mm | Detent Lock | Beige | 85 °C | -35 °C | Board to Cable/Wire | 11 | Solder Retention | Surface Mount | All | 8 µin | 0.203 µm | 4.8 mm | 0.189 in | Brass | Square | 150 VDC | Solder | Header | Nylon Polyamide (PA) | Gold | 0.049 in | 1.25 mm | Male Pin | UL94 V-0 | 1 | Shrouded - 3 Wall |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
Description
General part information
DF13C Series
Connector Header position
Documents
Technical documentation and resources
No documents available