Fans, Blowers, Thermal Management

WAVE-26-12

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Search across all available documentation for this part.

Fans, Blowers, Thermal Management

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	WAVE-26-12

Attachment Method	Clip
Fin Height	0.472 in
Fin Height	12 mm
Length [x]	1.024 in
Length [x]	26 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Shape [custom]	Angled Fins
Shape [custom]	Square
Thermal Resistance @ Forced Air Flow	5.21 °C/W
Type	Board Level
Width [x]	1.024 in
Width [x]	26 mm

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Fin Height	Fin Height	Type	Attachment Method	Material	Shape [custom]	Shape [custom]	Material Finish	Package Cooled	Length [x]	Length [x]
Wakefield Thermal Solutions WAVE-26-12	5.21 °C/W	1.024 in	26 mm	0.472 in	12 mm	Board Level	Clip	Aluminum Alloy	Angled Fins	Square	Black Anodized	BGA	1.024 in	26 mm
Wakefield Thermal Solutions WAVE-26-12	5.21 °C/W	1.024 in	26 mm	0.472 in	12 mm	Board Level	Clip	Aluminum Alloy	Angled Fins	Square	Black Anodized	BGA	1.024 in	26 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum Alloy Board Level

Technical documentation and resources