WAVE-26 Series

Catalog

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Fin Height	Fin Height	Type	Attachment Method	Material	Shape [custom]	Shape [custom]	Material Finish	Package Cooled	Length [x]	Length [x]
Wakefield Thermal Solutions WAVE-26-12	5.21 °C/W	1.024 in	26 mm	0.472 in	12 mm	Board Level	Clip	Aluminum Alloy	Angled Fins	Square	Black Anodized	BGA	1.024 in	26 mm
Wakefield Thermal Solutions WAVE-26-12	5.21 °C/W	1.024 in	26 mm	0.472 in	12 mm	Board Level	Clip	Aluminum Alloy	Angled Fins	Square	Black Anodized	BGA	1.024 in	26 mm