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Technical Specifications
Parameters and characteristics for this part
| Specification | AT97SC3205-H3M4500B |
|---|---|
| Applications | Trusted Platform Module (TPM) |
| Core Processor | AVR |
| Interface | SPI |
| Mounting Type | Surface Mount |
| Number of I/O | 4 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 32-VFQFN Exposed Pad |
| Program Memory Type | EEPROM |
| Supplier Device Package | 32-VQFN (4x4) |
| Voltage - Supply | 3.3 V |
| Part | Mounting Type | Supplier Device Package | Number of I/O | Applications | Core Processor | Voltage - Supply | Program Memory Type | Interface | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Package / Case | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
 Microchip Technology | Surface Mount | 28-TSSOP | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 70 °C | 0 °C | 28-TSSOP | 0.173 in | 4.4 mm |
Microchip Technology | Surface Mount | 28-TSSOP | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 28-TSSOP | 0.173 in | 4.4 mm |
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
 Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 70 °C | 0 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 70 °C | 0 °C | 32-VFQFN Exposed Pad |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Microchip Direct | TRAY | 1 | $ 3.72 | |
| 25 | $ 3.40 | |||
| 100 | $ 3.07 | |||
| 1000 | $ 2.83 | |||
| 5000 | $ 2.70 | |||
Description
General part information
AT97SC3205T Series
A fully integrated security module designed to integrate into computer systems and other embedded systems. Conforms to Trusted Computing Group (TCG) Main v1.2, r116, TIS v1.3 specifications.
Documents
Technical documentation and resources