FF IND SPI TPM 4X4 32VQFN CEK 32 VQFN 4X4X0.9MM T/R ROHS COMPLIANT: YES
| Part | Mounting Type | Supplier Device Package | Number of I/O | Applications | Core Processor | Voltage - Supply | Program Memory Type | Interface | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Package / Case | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
 Microchip Technology | Surface Mount | 28-TSSOP | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 70 °C | 0 °C | 28-TSSOP | 0.173 in | 4.4 mm |
Microchip Technology | Surface Mount | 28-TSSOP | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 28-TSSOP | 0.173 in | 4.4 mm |
 Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
 Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 70 °C | 0 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | I2C | 85 °C | -40 °C | 32-VFQFN Exposed Pad | ||
Microchip Technology | Surface Mount | 32-VQFN (4x4) | 4 | Trusted Platform Module (TPM) | AVR | 3.3 V | EEPROM | SPI | 70 °C | 0 °C | 32-VFQFN Exposed Pad |