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655-53AB
Fans, Blowers, Thermal Management

655-53AB

Active
Wakefield Thermal Solutions

HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, BGA, 40.6 MM, 13.31 MM, 41 MM

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Search across all available documentation for this part.

655-53AB
Fans, Blowers, Thermal Management

655-53AB

Active
Wakefield Thermal Solutions

HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, BGA, 40.6 MM, 13.31 MM, 41 MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification655-53AB
Attachment MethodThermal Tape, Adhesive
Fin Height0.522 in
Fin Height13.27 mm
Length [x]40.64 mm
Length [x]1.6 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledLGA, CPU, ASIC, BGA
Power Dissipation @ Temperature Rise4 W
ShapePin Fins, Square
Thermal Resistance @ Forced Air Flow2 °C/W
TypeTop Mount
Width [x]1.6 "
Width [x]40.64 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 3.17
1$ 3.17
10$ 3.08
10$ 3.08
25$ 3.00
25$ 3.00
50$ 2.83
50$ 2.83
100$ 2.67
100$ 2.67
250$ 2.50
250$ 2.50
500$ 2.42
500$ 2.42
1000$ 2.17
1000$ 2.17
N/A 835$ 2.35
835$ 2.35
NewarkEach 1$ 2.71
10$ 2.41
25$ 2.31
50$ 2.23
100$ 2.15
250$ 2.06
500$ 1.99
1000$ 1.92

Description

General part information

655-53 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.0W @ 40°C Top Mount

Documents

Technical documentation and resources