
Fans, Blowers, Thermal Management
655-53AB
ActiveWakefield Thermal Solutions
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, BGA, 40.6 MM, 13.31 MM, 41 MM
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Fans, Blowers, Thermal Management
655-53AB
ActiveWakefield Thermal Solutions
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, BGA, 40.6 MM, 13.31 MM, 41 MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 655-53AB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive |
| Fin Height | 0.522 in |
| Fin Height | 13.27 mm |
| Length [x] | 40.64 mm |
| Length [x] | 1.6 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | LGA, CPU, ASIC, BGA |
| Power Dissipation @ Temperature Rise | 4 W |
| Shape | Pin Fins, Square |
| Thermal Resistance @ Forced Air Flow | 2 °C/W |
| Type | Top Mount |
| Width [x] | 1.6 " |
| Width [x] | 40.64 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
655-53 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.0W @ 40°C Top Mount
Documents
Technical documentation and resources