Connectors, Interconnects

64-9518-10E

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Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

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Connectors, Interconnects

64-9518-10E

Active

Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	64-9518-10E

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	32
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	DIP
Type	22.86 mm
Type	0.9 in

64-9518 Series

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Type	Features	Contact Finish - Mating	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Termination	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [y]	Contact Finish - Post	Mounting Type
Aries Electronics 64-9518-10TE	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 "	2.54 mm	2	64	32	Tin	Through Hole
Aries Electronics 64-9518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 "	2.54 mm	2	64	32	Tin	Through Hole
Aries Electronics 64-9518-11	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	0.1 "	2.54 mm	2	64	32	Gold	Through Hole
Aries Electronics 64-9518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 "	2.54 mm	2	64	32	Tin	Through Hole
Aries Electronics 64-9518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	0.1 "	2.54 mm	2	64	32	Gold	Through Hole
Aries Electronics 64-9518-10E	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Open Frame	Gold	Brass	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 "	2.54 mm	2	64	32	Tin	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	22	$ 18.80
	N/A	0	$ 21.76

Description

General part information

64-9518 Series

64 (2 x 32) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources