64-9518 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 64POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Type | Type | Type | Features | Contact Finish - Mating | Contact Material - Post [custom] | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Termination | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [y] | Contact Finish - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Tin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Tin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Gold | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Tin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Gold | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | DIP | 22.86 mm | 0.9 in | Open Frame | Gold | Brass | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | 2 | 64 | 32 | Tin | Through Hole |