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Connectors, Interconnects

44-6556-30

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Aries Electronics

CONN IC DIP SOCKET 44POS GOLD

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DocumentsDatasheet
Connectors, Interconnects

44-6556-30

Active
Aries Electronics

CONN IC DIP SOCKET 44POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification44-6556-30
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)44 Positions or Pins
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length10.74 mm
Termination Post Length0.423 in
TypeDIP
Type0.6 in
Type15.24 mm

44-6556 Series

PartMounting TypeTermination Post LengthTermination Post LengthHousing MaterialContact Finish Thickness - PostContact Finish Thickness - PostTypeTypeTypeContact Finish - PostContact Finish - MatingCurrent Rating (Amps)Number of Positions or Pins (Grid)Material Flammability RatingFeaturesTerminationContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - MatingContact Material - Post [custom]Pitch - PostPitch - PostContact Material - Mating
Aries Electronics
Through Hole
3.3 mm
0.13 in
Polyphenylene Sulfide (PPS)
Glass Filled
10 çin
0.25 çm
DIP
0.6 in
15.24 mm
Gold
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
Solder
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
3.3 mm
0.13 in
Polyphenylene Sulfide (PPS)
Glass Filled
200 µin
5.08 µm
DIP
0.6 in
15.24 mm
Tin
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
Solder
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
7.19 mm
0.283 in
Polyphenylene Sulfide (PPS)
Glass Filled
200 µin
5.08 µm
DIP
0.6 in
15.24 mm
Tin
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
Wire Wrap
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
10.74 mm
0.423 in
Polyphenylene Sulfide (PPS)
Glass Filled
10 çin
0.25 çm
DIP
0.6 in
15.24 mm
Gold
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
Wire Wrap
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
4.57 mm
0.18 in
Polyphenylene Sulfide (PPS)
Glass Filled
200 µin
5.08 µm
DIP
0.6 in
15.24 mm
Tin
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
4.57 mm
0.18 in
Polyphenylene Sulfide (PPS)
Glass Filled
10 çin
0.25 çm
DIP
0.6 in
15.24 mm
Gold
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper
Aries Electronics
Through Hole
10.74 mm
0.423 in
Polyphenylene Sulfide (PPS)
Glass Filled
200 µin
5.08 µm
DIP
0.6 in
15.24 mm
Tin
Gold
3 A
44 Positions or Pins
UL94 V-0
Open Frame
Wire Wrap
30 Áin
0.76 Ám
0.1 in
2.54 mm
Brass
2.54 mm
0.1 in
Beryllium Copper

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 25$ 16.28

Description

General part information

44-6556 Series

44 (2 x 22) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources