44-6556 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 44POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Termination | Type [custom] | Type [custom] | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Features | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Finish - Post | Contact Material - Post [custom] | Mounting Type | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 3.3 mm | 0.13 in | Solder | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 10 Áin | 0.25 çm | Gold | Gold | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |
Aries Electronics | UL94 V-0 | 3 A | 7.19 mm | 0.283 " | Wire Wrap | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 10 Áin | 0.25 çm | Gold | Gold | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |
Aries Electronics | UL94 V-0 | 3 A | 3.3 mm | 0.13 in | Solder | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Gold | Tin | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |
Aries Electronics | UL94 V-0 | 3 A | 7.19 mm | 0.283 " | Wire Wrap | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Gold | Tin | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |
Aries Electronics | UL94 V-0 | 3 A | 10.74 mm | 0.423 in | Wire Wrap | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 10 Áin | 0.25 çm | Gold | Gold | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |
Aries Electronics | UL94 V-0 | 3 A | 4.57 mm | 0.18 in | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Gold | Tin | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 | |
Aries Electronics | UL94 V-0 | 3 A | 4.57 mm | 0.18 in | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 10 Áin | 0.25 çm | Gold | Gold | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 | |
Aries Electronics | UL94 V-0 | 3 A | 10.74 mm | 0.423 in | Wire Wrap | 15.24 mm | 0.6 in | DIP | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Open Frame | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Gold | Tin | Brass | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 |