Connectors, Interconnects

40-C182-00

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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Connectors, Interconnects

40-C182-00

Active

Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	40-C182-00

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Wire Wrap
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

40-C182 Series

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Housing Material	Type [custom]	Type [custom]	Type	Contact Finish - Post	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Features	Mounting Type	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 40-C182-10	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-11	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-30	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-11H	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-20	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-31	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-00	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Wire Wrap	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	30	$ 14.91
	N/A	0	$ 16.30

Description

General part information

40-C182 Series

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources