40-C182 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Housing Material	Type [custom]	Type [custom]	Type	Contact Finish - Post	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Features	Mounting Type	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 40-C182-10	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-11	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-30	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-11H	UL94 V-0	3 A	0.125 in	3.18 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-20	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm
Aries Electronics 40-C182-31	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	-55 C	125 °C	Solder	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Surface Mount	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-C182-00	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Tin	Beryllium Copper	-55 C	105 ░C	Wire Wrap	Gold	Brass	0.25 µm	10 µin	40	Closed Frame	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm