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ROHM UT6K3TCR
Discrete Semiconductor Products

UT6K3TCR

Active
Rohm Semiconductor

MOSFET 2N-CH 30V 5.5A HUML2020L8

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENExplanation for Marking+38
ROHM UT6K3TCR
Discrete Semiconductor Products

UT6K3TCR

Active
Rohm Semiconductor

MOSFET 2N-CH 30V 5.5A HUML2020L8

Deep-Dive with AI

DocumentsTechnical Data Sheet ENExplanation for Marking+38

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6K3TCR
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C5.5 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs4 nC
Input Capacitance (Ciss) (Max) @ Vds450 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs42 mOhm
Supplier Device PackageHUML2020L8
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 8584$ 0.77
NewarkEach (Supplied on Cut Tape) 1$ 0.77
10$ 0.62
25$ 0.56
50$ 0.49
100$ 0.43
250$ 0.39
500$ 0.34
1000$ 0.31

Description

General part information

UT6K3 Series

The Middle Power MOSFET UT6K3 is suitable for load switch and battery switch for mobile, DC/DC converter.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Anti-Whisker formation - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

ESD Data

Characteristics Data

Compliance of the RoHS directive

Environmental Data

Inner Structure

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Constitution Materials List

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

How to Create Symbols for PSpice Models

Models

Condition of Soldering / Land Pattern Reference

Package Information

Taping Information

Package Information