Connectors, Interconnects

48-6556-31

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Aries Electronics

UNIV TEST SOCKET RECEPT 6556

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Connectors, Interconnects

48-6556-31

Active

Aries Electronics

UNIV TEST SOCKET RECEPT 6556

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	48-6556-31

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	48
Number of Positions or Pins (Grid) [x]	24
Number of Positions or Pins (Grid) [y]	2
Operating Temperature	150 °C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Wire Wrap
Termination Post Length	0.423 in
Termination Post Length	10.74 mm
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

48-6556 Series

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Post [custom]	Features	Mounting Type	Type [custom]	Type [custom]	Type	Contact Finish - Post	Housing Material	Operating Temperature
Aries Electronics 48-6556-21	3 A	UL94 V-0	7.19 mm	0.283 "	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-30	3 A	UL94 V-0	10.74 mm	0.423 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-41	3 A	UL94 V-0	4.57 mm	0.18 in	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm		2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-20	3 A	UL94 V-0	7.19 mm	0.283 "	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-31	3 A	UL94 V-0	10.74 mm	0.423 in	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled	150 °C
Aries Electronics 48-6556-40	3 A	UL94 V-0	4.57 mm	0.18 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm		2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-10	3 A	UL94 V-0	3.3 mm	0.13 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Solder	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	-	13	$ 32.66
	N/A	0	$ 37.47

Description

General part information

48-6556 Series

48 (2 x 24) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available