48-6556 Series

Catalog

CONN IC DIP SOCKET 48POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Post [custom]	Features	Mounting Type	Type [custom]	Type [custom]	Type	Contact Finish - Post	Housing Material	Operating Temperature
Aries Electronics 48-6556-21	3 A	UL94 V-0	7.19 mm	0.283 "	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-30	3 A	UL94 V-0	10.74 mm	0.423 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-41	3 A	UL94 V-0	4.57 mm	0.18 in	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm		2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-20	3 A	UL94 V-0	7.19 mm	0.283 "	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-31	3 A	UL94 V-0	10.74 mm	0.423 in	0.76 Ám	30 Áin	10 Áin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Wire Wrap	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Gold	Polyphenylene Sulfide (PPS) Glass Filled	150 °C
Aries Electronics 48-6556-40	3 A	UL94 V-0	4.57 mm	0.18 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm		2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-6556-10	3 A	UL94 V-0	3.3 mm	0.13 in	0.76 Ám	30 Áin	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	Gold	0.1 "	2.54 mm	Solder	2	48	24	Brass	Open Frame	Through Hole	15.24 mm	0.6 in	DIP	Tin	Polyphenylene Sulfide (PPS) Glass Filled