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Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 24-3573-16 |
|---|---|
| Contact Finish - Mating | Nickel Boron |
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Mating | 1.27 µm |
| Contact Finish Thickness - Mating | 50 µin |
| Contact Finish Thickness - Post | 1.27 µm |
| Contact Finish Thickness - Post | 50 µin |
| Contact Material - Mating | Beryllium Nickel |
| Contact Material - Post | Beryllium Nickel |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
| Part | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Material - Mating | Features | Housing Material | Termination | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Type | Type | Type | Contact Finish - Mating | Contact Material - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 0.11 in | 2.78 mm | 10 çin | 0.25 çm | UL94 V-0 | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | Beryllium Copper | Through Hole | 10 çin | 0.25 çm |
 Aries Electronics | Tin | 0.11 in | 2.78 mm | 200 µin | 5.08 µm | UL94 V-0 | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | Through Hole | 200 µin | 5.08 µm | |
Aries Electronics | Nickel Boron | 0.11 in | 2.78 mm | 50 µin | 1.27 µm | UL94 V-0 | Beryllium Nickel | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | Beryllium Nickel | Through Hole | 50 µin | 1.27 µm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 22 | $ 34.46 | |
Description
General part information
24-3573 Series
24 (2 x 12) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
Documents
Technical documentation and resources