24-3573 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Termination | Mounting Type | Contact Finish - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Features | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | 0.1 in | 2.54 mm | 12 | 2 | 24 | Solder | Through Hole | Gold | Beryllium Copper | 10 Áin | 0.25 çm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Gold | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 0.25 µm | 10 µin | Beryllium Copper |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | 0.1 in | 2.54 mm | 12 | 2 | 24 | Solder | Through Hole | Nickel Boron | Beryllium Nickel | 50 µin | 1.27 µm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Nickel Boron | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | Beryllium Nickel |