Specification	20-35W000-10

Board Material	FR4 Epoxy Glass
Contact Finish - Post	Tin-Lead
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC-W
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Mounting Type	Through Hole
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

20-35W0 Series

Part	Material	Pitch	Pitch	Number of Positions	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Package Accepted	Board Thickness	Board Thickness	Board Thickness	Proto Board Type	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Contact Finish - Post	Termination	Pitch - Post	Pitch - Post	Board Material	Convert From (Adapter End)	Pitch - Mating	Pitch - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type
Aries Electronics 20-35W000-11-RC	FR4 Epoxy Glass	0.05 in	1.27 mm	20	0.5 "	12.7 mm	2 in	50.8 mm	SOIC	1.57 mm	0.062 "	0.0625 in	SMD to DIP
Aries Electronics 20-35W000-10														Brass	0.125 in	3.18 mm	Tin-Lead	Solder	0.1 in	2.54 mm	FR4 Epoxy Glass	SOIC-W	1.27 mm	0.05 in	7.62 mm	DIP	0.3 in	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly