Connectors, Interconnects
40-C182-21
ActiveAries Electronics
IC & COMPONENT SOCKETS LOCK/EJECT DIP SCKT WIRE WRAP 40 PINS
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Connectors, Interconnects
40-C182-21
ActiveAries Electronics
IC & COMPONENT SOCKETS LOCK/EJECT DIP SCKT WIRE WRAP 40 PINS
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Technical Specifications
Parameters and characteristics for this part
| Specification | 40-C182-21 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Closed Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 40 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.04 in |
| Termination Post Length | 1.02 mm |
| Type | DIP |
| Type [custom] | 15.24 mm |
| Type [custom] | 0.6 in |
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Mounting Type | Termination | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish - Post | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Housing Material | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Features | Contact Material - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Type [custom] | Type [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Through Hole | Wire Wrap | 14 | 200 µin | 5.08 µm | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP | Tin | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | Gold | Closed Frame | Beryllium Copper | ||||
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | Through Hole | Solder | 24 | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | DIP | Gold | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 125 °C | Gold | Closed Frame | Beryllium Copper | 12 | 2 | 15.24 mm | 0.6 in | ||
Aries Electronics | Through Hole | Wire Wrap | 14 | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP | Gold | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 125 °C | Gold | Closed Frame | Beryllium Copper | ||||||||
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Surface Mount | Solder | 40 | 200 µin | 5.08 µm | 0.25 µm | 10 µin | DIP | Tin | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | Gold | Closed Frame | Beryllium Copper | 15.24 mm | 0.6 in | ||||
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Surface Mount | Solder | 14 | 200 µin | 5.08 µm | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP | Tin | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | Gold | Closed Frame | Beryllium Copper | ||||
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Surface Mount | Solder | 40 | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | DIP | Gold | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 125 °C | Gold | Closed Frame | Beryllium Copper | 15.24 mm | 0.6 in | ||||
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Through Hole | Wire Wrap | 24 | 200 µin | 5.08 µm | 0.25 µm | 10 µin | DIP | Tin | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | Gold | Closed Frame | Beryllium Copper | 12 | 2 | 15.24 mm | 0.6 in | ||
Aries Electronics | 3 A | 0.04 in | 1.02 mm | UL94 V-0 | Through Hole | Wire Wrap | 32 | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | DIP | Gold | Brass | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 125 °C | Gold | Closed Frame | Beryllium Copper | 15.24 mm | 0.6 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
EJECT-A-CHIP Series
40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
Documents
Technical documentation and resources