EJECT-A-CHIP Series

Catalog

IC & COMPONENT SOCKETS LOCK/EJECT DIP SCKT WIRE WRAP 14 PINS

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Mounting Type	Termination	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Finish - Post	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Housing Material	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Features	Contact Material - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Type [custom]	Type [custom]
Aries Electronics 14-C195-30	3 A	0.04 in	1.02 mm	UL94 V-0	Through Hole	Wire Wrap	14	200 µin	5.08 µm	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	Tin	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	105 ░C	Gold	Closed Frame	Beryllium Copper
Aries Electronics 24-C300-11	3 A	0.125 in	3.18 mm	UL94 V-0	Through Hole	Solder	24	10 Áin	0.25 çm	0.25 µm	10 µin			DIP	Gold	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	125 °C	Gold	Closed Frame	Beryllium Copper	12	2	15.24 mm	0.6 in
Aries Electronics 14-C195-21					Through Hole	Wire Wrap	14	10 Áin	0.25 çm	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	Gold	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	125 °C	Gold	Closed Frame	Beryllium Copper
Aries Electronics 40-C300-00	3 A	0.04 in	1.02 mm	UL94 V-0	Surface Mount	Solder	40	200 µin	5.08 µm	0.25 µm	10 µin			DIP	Tin	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	105 ░C	Gold	Closed Frame	Beryllium Copper			15.24 mm	0.6 in
Aries Electronics 14-C280-00	3 A	0.04 in	1.02 mm	UL94 V-0	Surface Mount	Solder	14	200 µin	5.08 µm	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	Tin	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	105 ░C	Gold	Closed Frame	Beryllium Copper
Aries Electronics 40-C182-21	3 A	0.04 in	1.02 mm	UL94 V-0	Surface Mount	Solder	40	10 Áin	0.25 çm	0.25 µm	10 µin			DIP	Gold	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	125 °C	Gold	Closed Frame	Beryllium Copper			15.24 mm	0.6 in
Aries Electronics 24-C300-30	3 A	0.04 in	1.02 mm	UL94 V-0	Through Hole	Wire Wrap	24	200 µin	5.08 µm	0.25 µm	10 µin			DIP	Tin	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	105 ░C	Gold	Closed Frame	Beryllium Copper	12	2	15.24 mm	0.6 in
Aries Electronics 32-C300-21	3 A	0.04 in	1.02 mm	UL94 V-0	Through Hole	Wire Wrap	32	10 Áin	0.25 çm	0.25 µm	10 µin			DIP	Gold	Brass	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	-55 C	125 °C	Gold	Closed Frame	Beryllium Copper			15.24 mm	0.6 in