Fans, Blowers, Thermal Management

WAVE-29-127

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LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

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Fans, Blowers, Thermal Management

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	WAVE-29-127

Attachment Method	Clip
Fin Height	0.5 "
Fin Height	12.7 mm
Length	1.142 "
Length	29 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Shape [custom]	Angled Fins
Shape [custom]	Square
Thermal Resistance @ Forced Air Flow	4.08 °C/W
Type	Board Level
Width	29 mm
Width	1.142 "

Part	Attachment Method	Fin Height	Fin Height	Package Cooled	Width	Width	Material Finish	Thermal Resistance @ Forced Air Flow	Shape [custom]	Shape [custom]	Length	Length	Material	Type
Wakefield Thermal Solutions WAVE-29-127	Clip	0.5 "	12.7 mm	BGA	29 mm	1.142 "	Black Anodized	4.08 °C/W	Angled Fins	Square	1.142 "	29 mm	Aluminum Alloy	Board Level
Wakefield Thermal Solutions WAVE-29-127	Clip	0.5 "	12.7 mm	BGA	29 mm	1.142 "	Black Anodized	4.08 °C/W	Angled Fins	Square	1.142 "	29 mm	Aluminum Alloy	Board Level

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum Alloy Board Level

Technical documentation and resources