WAVE-29 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
| Part | Attachment Method | Fin Height | Fin Height | Package Cooled | Width | Width | Material Finish | Thermal Resistance @ Forced Air Flow | Shape [custom] | Shape [custom] | Length | Length | Material | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | Clip | 0.5 " | 12.7 mm | BGA | 29 mm | 1.142 " | Black Anodized | 4.08 °C/W | Angled Fins | Square | 1.142 " | 29 mm | Aluminum Alloy | Board Level |
Wakefield Thermal Solutions | Clip | 0.5 " | 12.7 mm | BGA | 29 mm | 1.142 " | Black Anodized | 4.08 °C/W | Angled Fins | Square | 1.142 " | 29 mm | Aluminum Alloy | Board Level |