
Deep-Dive with AI
Search across all available documentation for this part.
Documents655-26ABT5 | Datasheet

Deep-Dive with AI
Documents655-26ABT5 | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 655-26ABT5 |
|---|---|
| Attachment Method | Thermal Tape, Adhesive |
| Fin Height | 6.6 mm |
| Fin Height | 0.26 " |
| Length [x] | 40.64 mm |
| Length [x] | 1.6 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | LGA, CPU, ASIC, BGA |
| Power Dissipation @ Temperature Rise | 60 °C, 5 W |
| Shape | Pin Fins, Square |
| Thermal Resistance @ Forced Air Flow | 3 °C/W |
| Type | Top Mount |
| Width [x] | 1.6 " |
| Width [x] | 40.64 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 500 | $ 6.76 | |
| 500 | $ 6.76 | |||
| N/A | 0 | $ 4.93 | ||
| 0 | $ 4.93 | |||
Description
General part information
655-26 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 5.0W @ 60°C Top Mount
Documents
Technical documentation and resources