655-26 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
HEATSINK FOR 40MM BGA
| Part | Shape | Fin Height | Fin Height | Length [x] | Length [x] | Material Finish | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Width [x] | Width [x] | Type | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 6.6 mm | 0.26 " | 40.64 mm | 1.6 in | Black Anodized | Thermal Tape Adhesive | ASIC BGA CPU LGA | 5 W 60 °C | 3 °C/W | 1.6 " | 40.64 mm | Top Mount | Aluminum |